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 Converters    3M™ Thermally Conductive Tape
Converters > Electrical Tapes > Electrically Conductive Tape > 3M™ Thermally Conductive Tape > View Items  
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3M™ Thermally Conductive Tape

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3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are used to mechanically and thermally bond electronic components (packages and flexible circuits) to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. 3M™ Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2.0 mil, 5.0 mil, or 10.0 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductivity, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which allows for superior gap filling between the bonded substrates. This improved contact results in higher bond strength and lower thermal resistance. The PSA properties of these tapes make them easy to handle and apply without need for thermal bonding. These tapes are also repositionable and reworkable during assembly, and the final bond is permanent, eliminating the need for clamps and screws. All three thicknesses meet NASA low outgassing specifications (NASA SP-R-0022).



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Description 

9890 3M(TM) Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are used to mechanically and thermally bond electronic components (packages and flexible circuits) to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. 3M(TM) Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2.0 mil, 5.0 mil, or 10.0 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductivity, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which allows for superior gap filling between the bonded substrates. This improved contact results in higher bond strength and lower thermal resistance. The PSA properties of these tapes make them easy to handle and apply without need for thermal bonding. These tapes are also repositionable and reworkable during assembly, and the final bond is permanent, eliminating the need for clamps and screws. All three thicknesses meet NASA low outgassing specifications (NASA SP-R-0022).

10.0 mil thermally conductive adhesive on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding heat sinks to microprocessors, bonding TAB-mounted IC and power transistor to PCB, and power transistor to heat sink.
9885 These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. 3M(TM) Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2.0 mil, 5.0 mil, or 10.0 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductivity, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which allows for superior gap filling between the bonded substrates. This improved contact results in higher bond strength and lower thermal resistance. The PSA properties of these tapes make them easy to handle and apply without need for thermal bonding. These tapes are also repositionable and reworkable during assembly, and the final bond is permanent, eliminating the need for clamps and screws. All three thicknesses meet NASA low outgassing specifications (NASA SP-R-0022).

5.0 mil, thermally conductive adhesive transfer tape on 2.0 mil, polyester liner. For mounting thermoelectric cooling modules, bonding flexible circuits to heat sinks, bonding heat sinks to microprocessors and bonding TAB-mounted IC to PCB.
9885 Use to thermally bond electronic components and flexible circuits to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. See the Thermally Conductive application selection table to determine the proper 3M tape. 3M(TM) Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2 mil, 5 mil, or 10 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductiviy, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which allows for superior gap filling between the bonded substrates. This improved contact results in higher bond strength and lower thermal resistance. The PSA properties of these tapes make them easy to handle and apply without need for thermal bonding. These tapes are also repositionable and reworkable during assembly, and the final bond is permanent. Used for mounting thermoelectric cooling modules, laminating flexible circuits to heat sinks, and bonding heat sinks to integrated circuits.

Pressure sensitive acrylic adhesive with 58 lb polycoated kraft paper liner. High temperature and solvent resistance, high HSE and low LSE. Bonds heat sinks and rigidizers to flexible circuits. 5 mil thick with 4 mil liner.
9882 Use to thermally bond electronic components and flexible circuits to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. 3M(TM) Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2 mil, 5 mil, or 10 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductiviy, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which allows for superior gap filling between the bonded substrates. This improved contact results in higher bond strength and lower thermal resistance. The PSA properties of these tapes make them easy to handle and apply without need for thermal bonding. These tapes are also repositionable and reworkable during assembly, and the final bond is permanent. 2 mil thick with 4 mil liner. 2.0 mil (0.05 mm) thermally conductive tape for mounting heat foils, temperature indicating films and thermoelectric cooling modules, as well as laminating flexible circuits to heat sinks.

2.0 mil, thermally conductive adhesive transfer tape on 2.0 mil polyester liner. For mounting flexible heating foils, temperature indicating films and thermoelectric cooling modules, as well as bonding flexible circuits to heat sinks.
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