Used for pharmaceutical outsert attachment, general paper attachment, and for applications requiring a heavier liner to help reduce liner breakage during application.
(4)
Ideal for applications requiring high bond strength, high shear strength and high temperature performance. Some application ideas are: nameplates on award plaques, bonding foam insulation, difficult to bond folders and boxes and substrates requiring a higher internal strength adhesive.
(7)
Solvent free industry standard for graphic attachment and die-cut parts. High temperature performance (400° F short term). Excellent chemical and moisture resistance, and shear strength. Excellent adhesion to high surface energy substrates.
Higher peel strength than most other acrylic formulations. Exceptional shear strength even at elevated temperatures. Up to 550° F short term heat resistance and outstanding solvent resistance.
Same adhesive technology as found in or 3M™ VHB™ Tapes only in adhesive transfer tape format. Excellant for bonding decorative metal trim, and bonding flexible circuits to aluminum rigidizers or heat sinks.
Adhesive bonds to a wide variety of similar and dissimilar materials. Used to seal pocket in folders, bond matt board in picture frames, splice paper, films and foils, and for general purpose bindery attaching. Adhesive is reverse wound on 1inch cores for
Flexible to minus 60° F. Use to seal pocket in folders, bond matte board in picture frames, splice paper, films and foils, and for general purpose bindery attaching.
(3) Can be applied as low as 32°F. High temperature and solvent resistance. Bonds well to high and low surface energy plastics and foams Excellent where UV resistance is required
(5)
Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). It is modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface. Offers excellent adhesive performance with good wetting and flow onto many substrate surfaces. Offers both good thermal conductivity and good electrical insulation properties. Only pressure is needed to form an excellent bond and thermal interface.
(2)
Solvent free industry standard for graphic attachment and die-cut parts. High temperature performance (400° F short term). Excellent chemical and moisture resistance, and shear strength. Excellent adhesion to high surface energy substrates.